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C100SMNR Series — Wirewound, Conical

C100SMNR Series

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Dimensional Specifications

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Series Data

For helpful information regarding the data in the following table please refer to the Notes section below the table. To request a sample, please indicate your choice in the columns to the right in the table. To check distributor stock, please click on a specific part number in the table.

Part number L µH Turns DCR OHMS
NOM
Current Rating
mA DC
Wire Size
(AWG)
Wire Type Core
Material
Request
Sample
C100SMNR1938G60.26190.1065538Gold Plated CopperPowdered Iron
C100SMNR2540G60.37250.2145240Gold Plated CopperPowdered Iron
C100SMNR3142G60.69310.4730242Gold Plated CopperPowdered Iron
C100SMNR3944G61.00390.7424144Gold Plated CopperPowdered Iron
C100SMNR4947G61.54491.7014047Gold Plated CopperPowdered Iron

Notes

 Inductance is measured @ 10 MHz

Operating Temperature Range: -55°C to +125°C

Current rating is based on a 35°C temperature rise at an ambient temperature of 90°C

All non-tolerance dimensions and electrical data are reference only and based on nominal data

Recommended that component is epoxied to substrate before soldering. Outgas testing qualified to ASTM E 595

Terminal is enlongated to allow for soldering up to the coil tip

Meets a TML (Total Mass Loss) requirement of 1.0% maximum when tested in accordance with ASTM E-595

S-Parameter is availble at the www.modelithics.com/mvp/GOWANDA/ website for the C100SMNR series.  You will need to set up an account to access this data.    Please contact us if you have any questions, or concerns relative to obtaining this information.

Datasheet

Please contact Gowanda for more information.

Reflow Profiles

Please select the reflow soldering profile below that best suits your process. These reflow profiles represent typical industry standards. If you need additional assistance please contact Gowanda Electronics directly.

Reliability Data

Please note that reliability testing (HRIP Life Test) has been done for many, but not all, of Gowanda Electronics' products, in keeping with the needs of specific applications. Please use the information in this table as a guide; for additional assistance please contact Gowanda.

P/NTestTest ConditionsDurationPcs/TestedFailures
050AT3303SM Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
050KM3303SM Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
10M101K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
  Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 25 cycles 12 0
  Humidity per Mil-Std-202, Method 103 90-95% RH at 40 Degrees C 240 hrs 12 0
10M272K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
17S105K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
CC1008-101M Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
CC1008-471M Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
CF1008-151M Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SM3-010K Extended Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 10,000 hrs 10 0
  Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 5 cycles 12 0
  Humidity per Mil-Std-202, Method 103 90-95% RH at 40 Degrees C 240 hrs 12 0
  Overload per Mil-Std-15305, Para 4.8.10 1 1/2 Times Rated I 5 minutes 4 0
  Low Temp Storage per Mil-Std-15305, Para 4.8.14 Normal mounting and subjected to -65 C 96 hrs 4 0
  Resistance to solder heat Mil-Std-202, Method 210 SMI Reflow Thermal Profile (183 C PH, 250 C) 2 minutes 12 0
SM3-102K Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 10 0
  Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 5 cycles 12 0
  Humidity per Mil-Std-202, Method 103 90-95% RH at 40 Degrees C 240 hrs 12 0
  Overload per Mil-Std-15305, Para 4.8.10 1 1/2 Times Rated I 5 minutes 4 0
  Low Temp Storage per Mil-Std-15305, Para 4.8.14 Normal mounting and subjected to -65 C 96 hrs 4 0
  Resistance to solder heat Mil-Std-202, Method 210 SMI Reflow Thermal Profile (183 C PH, 250 C) 2 minutes 12 0
SMP3308-104M Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMP3013-102K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMP3013-104K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMP3315-103M Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
  Thermal Shock per Mil-Std-202, Method 107 -40 C to +70 C with 15 min dwell for saturation 1000 cycles 60 0
SMP3316-473M Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMP3316-104M Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMP5022-103M Vibration per Mil-Std-202, Method 201 Low Frequency Vibe in Z Direction 2 hrs 2 0
  Shock per Mil-Std-202, Method 213 Shock in Z Direction 3 Pulses 2 0
  Thermal Shock per Mil-Std-202 Method 107 -55 C to +125 C with 15 min dwell for saturation 100 cycles 2 0
  Resistance to solder heat Mil-Std-202, Method 210 Solder Dip 3 dips each 2 0
SMP5025-105K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMP8527-105K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMRF1812-101J Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 6 0
  Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 200 cycles 6 0
  Humidity per Mil-Std-202, Method 103 85 C, 85% Humidity at Full Rated I 1000 hrs 6 0
SMRF1812-104J Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 6 0
  Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 200 cycles 6 0
  Humidity per Mil-Std-202, Method 103 85 C, 85% Humidity at Full Rated I 1000 hrs 6 0
SMRF5025-104K Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMRF5025-100K Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 50 cycles 10 0
  DWV per Mil-Std-202, Method 301 200 VDC between windings 30 seconds 10 0
  IR per Mil-Std-202, Method 302 500 VDC / 100 Mohm R min. core to windings 2 minutes 10 0
  Barometric Pressure per Mil-Std-202, Method 105 200 VDC at 70,000 feet altitude 60 seconds 10 0
  Solderability per Mil-Std-202, Method 208, Cat. 3 8 hrs of staem age and 1 solder dip 5 seconds 10 0
  High Temp Exposure per Mil-Prf-83446, Sec. 4.6.14 Normal mounting and subjected to +125 C 96 hrs 10 0
SMRF5025-823K Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 50 cycles 10 0
  DWV per Mil-Std-202, Method 301 200 VDC between windings 60 Seconds 10 0
  IR per Mil-Std-202, Method 302 500 VDC / 100 Mohm R min. core to windings 2 minutes 10 0
  Barometric Pressure per Mil-Std-202, Method 105 DWV (200 VDC) at 70,000 feet altitude 60 seconds 10 0
  Solderability per Mil-Std-202, Method 208, Cat. 3 8 hrs of staem age and 1 solder dip 5 seconds 10 0
  High Temp Exposure per Mil-Prf-83446, Sec. 4.6.14 Normal mounting and subjected to +125 C 96 hrs 10 0
SMT45-303 Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
Maximum Quantity per Reel REEL DIAMETER (in.) PITCH BETWEEN PARTS (mm) TAPE WIDTH (mm) Class #
600 7 8 16

Weights

Weight in Grams (per inductor):   0.0135

Standard Termination Finishes Lead Free Termination Finishes
Contact Factory Sn 99.3% Cu .7%