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SMP3340 Series — Wirewound, Open Construction

SMP3340 Series

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Dimensional Specifications

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Series Data

For helpful information regarding the data in the following table please refer to the Notes section below the table. To request a sample, please indicate your choice in the columns to the right in the table. To check distributor stock, please click on a specific part number in the table.

Part number L µH Inductance
Tolerance
DCR OHMS
MAX
Current Rating
mA DC
Saturation
Current DC mA
Core
Material
Marking Request
Sample
SMP3340-102M10±20%0.03542009000Ferrite10µH
SMP3340-152M15±20%0.0439007400Ferrite15µH
SMP3340-222M22±20%0.06630006000Ferrite22µH
SMP3340-332M33±20%0.0828004800Ferrite33µH
SMP3340-472M47±20%0.1123004000Ferrite47µH
SMP3340-682M68±20%0.1421003600Ferrite68µH
SMP3340-103M100±20%0.2217002800Ferrite100µH
SMP3340-153M150±20%0.3214002400Ferrite150µH
SMP3340-223M220±20%0.4412001800Ferrite220µH
SMP3340-333M330±20%0.79301600Ferrite330µH
SMP3340-473M470±20%0.958001200Ferrite470µH
SMP3340-683M680±20%1.27101000Ferrite680µH
SMP3340-104M1000±20%2550840Ferrite1000µH

Notes

Suffix "M" for 20% tolerance
Custom designs are available to meet your specific requirements; please contact factory

Operating temperature -55°C to +125°C

Current rating is based on a 40°C temperature rise at an ambient temperature of 85°C

Saturation current is the approximate value that will reduce the intital inductance by 10%

Reflow Profiles

Please select the reflow soldering profile below that best suits your process. These reflow profiles represent typical industry standards. If you need additional assistance please contact Gowanda Electronics directly.

Reliability Data

Please note that reliability testing (HRIP Life Test) has been done for many, but not all, of Gowanda Electronics' products, in keeping with the needs of specific applications. Please use the information in this table as a guide; for additional assistance please contact Gowanda.

P/NTestTest ConditionsDurationPcs/TestedFailures
050AT3303SM Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
050KM3303SM Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
10M101K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
  Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 25 cycles 12 0
  Humidity per Mil-Std-202, Method 103 90-95% RH at 40 Degrees C 240 hrs 12 0
10M272K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
17S105K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
CC1008-101M Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
CC1008-471M Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
CF1008-151M Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SM3-010K Extended Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 10,000 hrs 10 0
  Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 5 cycles 12 0
  Humidity per Mil-Std-202, Method 103 90-95% RH at 40 Degrees C 240 hrs 12 0
  Overload per Mil-Std-15305, Para 4.8.10 1 1/2 Times Rated I 5 minutes 4 0
  Low Temp Storage per Mil-Std-15305, Para 4.8.14 Normal mounting and subjected to -65 C 96 hrs 4 0
  Resistance to solder heat Mil-Std-202, Method 210 SMI Reflow Thermal Profile (183 C PH, 250 C) 2 minutes 12 0
SM3-102K Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 10 0
  Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 5 cycles 12 0
  Humidity per Mil-Std-202, Method 103 90-95% RH at 40 Degrees C 240 hrs 12 0
  Overload per Mil-Std-15305, Para 4.8.10 1 1/2 Times Rated I 5 minutes 4 0
  Low Temp Storage per Mil-Std-15305, Para 4.8.14 Normal mounting and subjected to -65 C 96 hrs 4 0
  Resistance to solder heat Mil-Std-202, Method 210 SMI Reflow Thermal Profile (183 C PH, 250 C) 2 minutes 12 0
SMP3308-104M Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMP3013-102K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMP3013-104K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMP3315-103M Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
  Thermal Shock per Mil-Std-202, Method 107 -40 C to +70 C with 15 min dwell for saturation 1000 cycles 60 0
SMP3316-473M Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMP3316-104M Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMP5022-103M Vibration per Mil-Std-202, Method 201 Low Frequency Vibe in Z Direction 2 hrs 2 0
  Shock per Mil-Std-202, Method 213 Shock in Z Direction 3 Pulses 2 0
  Thermal Shock per Mil-Std-202 Method 107 -55 C to +125 C with 15 min dwell for saturation 100 cycles 2 0
  Resistance to solder heat Mil-Std-202, Method 210 Solder Dip 3 dips each 2 0
SMP5025-105K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMP8527-105K Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMRF1812-101J Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 6 0
  Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 200 cycles 6 0
  Humidity per Mil-Std-202, Method 103 85 C, 85% Humidity at Full Rated I 1000 hrs 6 0
SMRF1812-104J Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 6 0
  Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 200 cycles 6 0
  Humidity per Mil-Std-202, Method 103 85 C, 85% Humidity at Full Rated I 1000 hrs 6 0
SMRF5025-104K Life per Mil-Std-202, Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
SMRF5025-100K Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 50 cycles 10 0
  DWV per Mil-Std-202, Method 301 200 VDC between windings 30 seconds 10 0
  IR per Mil-Std-202, Method 302 500 VDC / 100 Mohm R min. core to windings 2 minutes 10 0
  Barometric Pressure per Mil-Std-202, Method 105 200 VDC at 70,000 feet altitude 60 seconds 10 0
  Solderability per Mil-Std-202, Method 208, Cat. 3 8 hrs of staem age and 1 solder dip 5 seconds 10 0
  High Temp Exposure per Mil-Prf-83446, Sec. 4.6.14 Normal mounting and subjected to +125 C 96 hrs 10 0
SMRF5025-823K Thermal Shock per Mil-Std-202, Method 107 -55 C to +125 C with 15 min dwell for saturation 50 cycles 10 0
  DWV per Mil-Std-202, Method 301 200 VDC between windings 60 Seconds 10 0
  IR per Mil-Std-202, Method 302 500 VDC / 100 Mohm R min. core to windings 2 minutes 10 0
  Barometric Pressure per Mil-Std-202, Method 105 DWV (200 VDC) at 70,000 feet altitude 60 seconds 10 0
  Solderability per Mil-Std-202, Method 208, Cat. 3 8 hrs of staem age and 1 solder dip 5 seconds 10 0
  High Temp Exposure per Mil-Prf-83446, Sec. 4.6.14 Normal mounting and subjected to +125 C 96 hrs 10 0
SMT45-303 Life per Mil-Std-202 Method 108 90 C ambient, Full Rated I, 75% on, 25% off 2,000 hrs 10 0
MAXIMUM QUANTITY PER REEL REEL DIAMETER: in. (mm) PITCH BETWEEN PARTS: in. (mm) TAPE WIDTH: in. (mm) CLASS #
200 13 (330.2) 0.945 (24) 0.945 (24)

Weights

Weight in Grams (per inductor):   2.6

Standard Termination Finishes Lead Free Termination Finishes
Sn63Pb37 Matte Sn99.9