Robust RF Inductors Now Offer Shielding

Gowanda, NY (USA) – Gowanda Electronics announces the introduction of a new series of surface mount inductors – SMRF1812S – that offers the same robust design as the company’s SMRF1812 series, but with the added benefit of shielding which enables the “S” series to be used in applications where coupling between board components is a concern due to board density.

This new series is targeted for use in RF applications where board manufacturers require rugged inductors that will withstand the demands of harsh soldering processes, and the product application requires shielding of the inductors due to close proximity of electronic components on the board.

Gowanda Electronics utilizes the same proprietary manufacturing process for the SMRF1812S series as is used for the SMRF1812 series, in order to maximize the robustivity of the device. This is accomplished by centering the coil within the device to minimize stress on internal component parts, and by incorporating a high temperature magnet wire. The design also utilizes a semiconductor grade epoxy molding compound to enhance product quality and reliability. The epoxy compound used for the “S” series also contains specific additives that provide the shielding effect.

Applications for the SMRF1812S inductors include all RF signal circuitry in communications equipment, test & measurement equipment, medical diagnostic equipment and industrial process control equipment. Other applications include use in telecommunications, disk drives, computers and modems and other computer peripherals, as well as in security systems, instrumentation, bar code and laboratory analysis equipment, aviation equipment, navigation equipment, electronic test equipment, and cable TV.

Reliability testing has validated the performance of the SMRF1812 inductors. As the manufacturing processes are identical, it is anticipated that results would be the same for the “S” series. Testing of the SMRF1812 inductors was completed by Gowanda Electronics and began with preconditioning of the inductors via 4 cycles of reflow soldering that peaked out at 250°C for 30 seconds, followed by 1 cycle of complete solder submersion at 245°C. The preconditioned components then passed the following tests: 200 cycles of thermal shock, 2000 hours of life test (full load), 1000 hours of 85/85 humidity with load, drop test (1 meter, 10 times), and shear test (4.4 pounds).