Reliability Data

RELIABILITY TEST DATA

Reliability testing (HRIP Life Test) has been done for many, but not all, of Gowanda Electronics’ products, in keeping with the needs of specific applications. Please use the information in this table as a guide; for additional assistance please contact Gowanda.

Part NumberTestTest ConditionsDurationPcs TestedFailures
050AT3303SMLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
050KM3303SMLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
10M101KLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
10M101KThermal Shock per MIL-STD-202, Method 107-55°C to +125°C with 15 min dwell for saturation25 cycles120
10M101KHumidity per MIL-STD-202, Method 10390 - 95% RF fat 40°C240 hrs120
10M272KLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
17S105KLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
CC1008-101MLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
CC1008-471MLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
CF1008-151MLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
SM3-010KExtended Life per MIL-STD-202, Method 10890°C ambient, Full Rated I, 75% on, 25% off10,000 hrs100
SM3-010KThermal Shock per MIL-STD-202, Method 107-55°C to +125°C with 15 min dwell for saturation5 cycles120
SM3-010KHumidity per MIL-STD-202, Method 10390 - 95% RH at 40°C240 hrs120
SM3-010KOverload per MIL-STD-15305, Para 4.8.101 1/2 Times Rated I5 min40
SM3-010KLow Temp Storage per MIL-STD-15305, Para 4.8.14Normal mounting and subjected to -65°C96 hrs40
SM3-010KResistance to Solder Heat MIL-STD-202, Method 210SMI Reflow Thermal Profile (183°C PH, 250°C) 2 min120
SM3-102K<Life per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
SM3-102K<Thermal Shock per MIL-STD-202, Method 107-55°C to +125°C with 15 min dwell for saturation5 cycles120
SM3-102K<Humidity per MIL-STD-202, Method 10390 - 95% RH at 40°C240 hrs120
SM3-102K<Overload per MIL-STD-15305, Para 4.8.101 1/2 Times Rated I5 min40
SM3-102K<Low Temp Storage per MIL-STD-15305, Para 4.8.14Normal mounting and subjected to -65°C96 hrs40
SM3-102K<Resistance to Solder Heat MIL-STD-202, Method 210SMI Reflow Thermal Profile (183°C PH, 250°C)2 min120
SMP3308-104MLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
SMP3013-102KLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
SMP3013-104KLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
SMP3316-103MLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
SMP3316-103MThermal Shock per MIL-STD-202, Method 107-40°C to +70°C with 15 min dwell for saturation1,000 cycles600
SMP3316-473MLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
SMP3316-104MLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
SMP5022-103MVibration per MIL-STD-202, Method 201Low Frequency Vibe in Z Direction2 hrs20
SMP5022-103MShock per MIL-STD-202, Method 213Shock in Z Direction3 Pulses20
SMP5022-103MThermal Shock per MIL-STD-202, Method 107-55°C to +125°C with 15 min dwell for saturation100 Cycles20
SMP5022-103MResistance to Solder Heat MIL-STD-202, Method 210Solder Dip3 dips each20
SMP8527-105KLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
SMP8527-105KLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100
SMRF1812-101JLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs60
SMRF1812-101JThermal Shock per MIL-STD-202, Method 107-55°C to +125°C with 15 min dwell for saturation200 cycles60
SMRF1812-101JHumidity per MIL-STD-202, Method 10385°C, 85% Humidity at Full Rated I1,000 hours60
SMRF1812-104JLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hours60
SMRF1812-104JThermal Shock per MIL-STD-202, Method 107-55°C to +125°C with 15 min dwell for saturation200 cycles60
SMRF1812-104JHumidity per MIL-STD-202, Method 10385°C, 85% Humidity at Full Rated I1,000 hours60
SMRF5025-104KLife per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hours100
SMRF5025-100KThermal Shock per MIL-STD-202, Method 107-55°C to +125°C with 15 min dwell for saturation50 cycles100
SMRF5025-100KDWV per MIL-STD-202, Method 301200 VDC between windings30 sec.100
SMRF5025-100KIR per MIL-STD-202, Method 302500 VDC / 100 mΩ R min. core to windings2 min100
SMRF5025-100KBarometric Pressure per MIL-STD-202, Method 105200 VDC to 70,000 feet altitude60 sec100
SMRF5025-100KSolderability per MIL-STD-202, Method 208, Cat. 38 hrs of steam age and 1 solder dip5 sec100
SMRF5025-100KHigh Temp Exposure per MIL-PRF-83446, Sec. 4.6.14Normal mounting and subjected to +125°C96 hrs100
SMRF5025-823KThermal Shock per MIL-STD-202, Method 107-55°C to +125°C with 15 min dwell for saturation50 cycles100
SMRF5025-823KDWV per MIL-STD-202, Method 301200 VDC between windings60 sec100
SMRF5025-823KIR per MIL-STD-202, Method 302500 VDC / 100 mΩ R min. core to windings2 min100
SMRF5025-823KBarometric Pressure per MIL-STD-202, Method 105200 VDC to 70,000 feet altitude60 sec100
SMRF5025-823KSolderability per MIL-STD-202, Method 208, Cat. 38 hrs of steam age and 1 solder dip5 sec100
SMRF5025-823KHigh Temp Exposure per MIL-PRF-83446, Sec. 4.6.14Normal mounting and subjected to +125°C96 hrs100
SMT45A-303Life per MIL-STD-202 Method 10890°C ambient, Full Rated I, 75% on, 25% off2,000 hrs100